Laser microwelding in electronics: limitations and solutions for a further miniaturization

Michael Hubert Marcus Schmidt; Andreas Otto

doi:10.1117/12.396439

25 August 2000 Laser microwelding in electronics: limitations and solutions for a further miniaturization

Michael Hubert Marcus Schmidt, Andreas Otto

Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396439
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

Looking at today's production of microelectronics, the laser is a commonly used tool for many purposes. Especially laser micro welding of electronic contacts, the application discussed here, gains more and more importance in industrial production. The reasons are its high flexibility, the absence of a third joining partner like solder, the high temperature resistance and finally its high miniaturization potential.

Citation Download Citation

Michael Hubert Marcus Schmidt and Andreas Otto "Laser microwelding in electronics: limitations and solutions for a further miniaturization", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396439

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