Infrared Imaging Techniques To Determine The Bond Integrity In High Density Lap Soldered Printed Circuit Boards

R. Paulson; H. Decker; J. Hodor; J. Barney; T. Schapp

doi:10.1117/12.936396

19 January 1984 Infrared Imaging Techniques To Determine The Bond Integrity In High Density Lap Soldered Printed Circuit Boards

R. Paulson, H. Decker, J. Hodor, J. Barney, T. Schapp

Author Affiliations +

Proceedings Volume 0430, Infrared Technology IX; (1984) https://doi.org/10.1117/12.936396
Event: 27th Annual Technical Symposium, 1983, San Diego, United States

Abstract

As the electronics world continues to increase in complexity, yet demanding reduced size and higher reliability, the problem of product assurance becomes more difficult. Inspection techniques must keep pace. To accomplish this, infrared techniques have been applied to the non-destructive analysis of high density, multi-layer printed circuit boards and in particular the area regarding the integrity of lap solder bonds. An 8 - 13 micron infrared scanner was used to observe the circuit boards while heat was flowing through the bonds under test. The general procedure was to actively apply heat or cold in some way to the component or to the circuit board and observe the rate of heat flow through the bonded leads. Fast flow indicated a good bond while slow flow a poor bond. All the leads to one component could be done at one glance. Although emissivity variations both from the material's differences and shape presented some problems, five different infrared techniques proved successful as applicable for NDT tests.

Citation Download Citation

R. Paulson, H. Decker, J. Hodor, J. Barney, and T. Schapp "Infrared Imaging Techniques To Determine The Bond Integrity In High Density Lap Soldered Printed Circuit Boards", Proc. SPIE 0430, Infrared Technology IX, (19 January 1984); https://doi.org/10.1117/12.936396

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
10 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Lead

Infrared radiation

Infrared imaging

Scanners

Inspection

Thermography

Capacitors

Show All Keywords

Keywords/Phrases

Search In:

Publication Years