Paper
14 September 2001 Achieving low-wavefront specifications for DUV lithography: impact of residual stress in HPFS fused silica
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Abstract
As optical lithographers push to extend optical lithography technologies to create smaller features with higher NA, lower k1 values and shorter wavelengths, transmitted wavefront specifications for HPFSR fused silica blanks continue to tighten. HPFSR fused silica blanks are typically certified for acceptance using an interferometer operating at a wavelength of 632.8 nm. As the market demands increasingly tighter homogeneity specifications, it has become critical to understand the sources of variation in wavefront measurements. Corning has recently initiated a study to identify those sources of variation. One glass attribute being studied is the impact of residual stress on the wavefront. It is known that residual stresses can alter the refractive index of fused silica. To obtain the residual stress measurements, birefringence measurements were obtained at 632.8 nm for comparison to wavefront measurements at 632.8 nm. The relationship between residual birefringence and transmitted wavefront measurements, at 632.8 nm on Corning HPFSR fused silica blanks, is explored in this paper.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Julie L. Ladison, Joseph F. Ellison, Douglas C. Allan, David R. Fladd, Andrew W Fanning, and Richard Priestley "Achieving low-wavefront specifications for DUV lithography: impact of residual stress in HPFS fused silica", Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); https://doi.org/10.1117/12.435680
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Cited by 6 scholarly publications.
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KEYWORDS
Birefringence

Silica

Wavefronts

Wavefront distortions

Refraction

Refractive index

Interferometers

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