Paper
15 November 2002 Polymer-waveguide-based fully embedded board-level optoelectronic interconnects
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Abstract
A fully embedded board-level guided wave optical interconnection is presented to solve the packaging compatibility problem. All elements involved in providing high speed optical communications within a board are demonstrated. Experimental results on a 12-channel linear array of polymeric waveguides, thin film VCSELs (10 μm), and GaAs MSM photodetectors suitable for a fully embedded implementation are provided. By embedded approach, all the real estate of the PC board surface are occupied by electronics so that one only observes the performance enhancement due to the employment of optical interconnection without any interface problems between electronic and optoelectronic components. Thin film 1X12 linear array VCSEL and GaAs MSM detector were demonstrated and thermal management issue of the VCSEL in the fully embedded scheme was discussed.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chulchae Choi, Lei Lin, Yujie Liu, and Ray T. Chen "Polymer-waveguide-based fully embedded board-level optoelectronic interconnects", Proc. SPIE 4788, Photonic Devices and Algorithms for Computing IV, (15 November 2002); https://doi.org/10.1117/12.451645
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Cited by 3 scholarly publications.
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KEYWORDS
Vertical cavity surface emitting lasers

Waveguides

Optical interconnects

Copper

Gallium arsenide

Resistance

Packaging

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