Paper
30 May 2003 Photochemical laminating of low-refractive-index transparent antireflective SiO2 film
Masataka M. Murahara, Yasuhiro Ogawa, Kunio Yoshida, Yoshiaki Okamoto
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Abstract
A transparent low refractive index SiO2 film was laminated on a glass substrate with photochemical reaction by an Xe2* excimer lamp in the presence or NF3, 02 and silicon wafer at room temperature. The glass substrate and the silicon wafer were placed in the reaction chamber, which was filled with NF3 and O2 gases in the mixing ratio of 10:1 and under 330 Torr. The Xe2* excimer lamp was, then, irradiated for 20 minutes. The SiO2 film was spontaneously laminated on the glass substrate by repeating an adsorption of SiF4 and a photochemical oxidization with NO2, which was photo-dissociated from a mixed gas of NF3 and O2. The film thickness was 160 nm and the infrared spectrum was measured; the Si-O peaks were depicted at 600, 700, 1100[1/cm-1]. And Si-F peak was observed at 740[1/cm-1]. Then, the refractive index of the SiO2 film was 1.36. After annealing the film for one hour at 200 degree, the refractive index increased to 1.42.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masataka M. Murahara, Yasuhiro Ogawa, Kunio Yoshida, and Yoshiaki Okamoto "Photochemical laminating of low-refractive-index transparent antireflective SiO2 film", Proc. SPIE 4932, Laser-Induced Damage in Optical Materials: 2002 and 7th International Workshop on Laser Beam and Optics Characterization, (30 May 2003); https://doi.org/10.1117/12.472489
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Cited by 5 scholarly publications.
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KEYWORDS
Glasses

Refractive index

Annealing

Lamps

Semiconducting wafers

Silicon

Silica

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