Paper
14 November 2002 Laser-LIGA for Ni microcantilevers
Author Affiliations +
Proceedings Volume 4935, Smart Structures, Devices, and Systems; (2002) https://doi.org/10.1117/12.476113
Event: SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems, 2002, Melbourne, Australia
Abstract
This paper presents our design and experimental results of nickel microcantilevers, which were fabricated using a laser-LIGA process, based on KrF (248 nm) excimer laser micromachining. A chrome-on-quartz mask, containing the desired mask patterns was prepared for this work. The substrate of copper (30 μm thick) clad printed circuit board (PCB) was laminated with Laminar 5038 photopolymer to be laser patterned. Following laser patterning and laser cleaning, all the samples were electroformed with nickel on top of the copper layer. To release the Ni microcantilevers, the excimer laser was employed again to remove the polymer in the localised area to facilitate Cu selective etching. Here, copper acted as the sacrificial layer as well. The Cu selective etching was carried out with ~ 20 % (wt) aqueous solution of ammonium persulfate. Because the Cu selective etching is isotropic, some undercuts happened next to the anchor area. The samples were characterised using optical microscope, confocal laser scanning microscope and SEM, and some of Ni cantilevers were tested electro-thermally. Their performance was analyzed with respect to the simulation results.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hengyi Jin, Erol C. Harvey, Jason P. Hayes, Muralidhar K. Ghantasala, Yao Fu, Karlo Jolic, Matthew Solomon, and Kynan Graves "Laser-LIGA for Ni microcantilevers", Proc. SPIE 4935, Smart Structures, Devices, and Systems, (14 November 2002); https://doi.org/10.1117/12.476113
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Cited by 4 scholarly publications.
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KEYWORDS
Nickel

Excimer lasers

Copper

Polymers

Etching

Micromachining

Actuators

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