High-speed singulation of electronic packages using a frequency-doubled Nd:YAG laser in a water jet and realization of a 200-W green laser

Frank Ruediger Wagner; Wentao Hu; Akos Spiegel; Nandor Vago; Bernold Richerzhagen

doi:10.1117/12.478611

17 October 2003 High-speed singulation of electronic packages using a frequency-doubled Nd:YAG laser in a water jet and realization of a 200-W green laser

Frank Ruediger Wagner, Wentao Hu, Akos Spiegel, Nandor Vago, Bernold Richerzhagen

Author Affiliations +

Proceedings Volume 4977, Photon Processing in Microelectronics and Photonics II; (2003) https://doi.org/10.1117/12.478611
Event: High-Power Lasers and Applications, 2003, San Jose, CA, United States

Abstract

Each electronic chip is packaged in order to connect the integrated circuit and the printed circuit board. In consequence high-speed singulation of packages is an important step in the manufacturing process of electronic devices. The widely used technique of abrasive sawing encounters problems due to the combination of different materials used in packages such as copper and mold compound. The sawing blade rapidly blunts because of the copper adhering to the saw blade and covering the diamonds. In fact, the abrasive saw, well adapted to silicon wafer sawing, has problems to adapt to package materials. It has already been shown that the water jet guided laser can be used for efficient high quality singulation of leadframe based packages. In this technique a low-pressure water jet guides the laser beam like an optical fiber, providing efficient cooling of the cutting kerf at exactly the point that was heated during the laser pulse. We present new cutting results using a frequency doubled Nd:YAG laser with 100 W average power, and the combination setup for generating a 200 W green laser beam. The timing between the two lasers can be precisely controlled.

Citation Download Citation

Frank Ruediger Wagner, Wentao Hu, Akos Spiegel, Nandor Vago, and Bernold Richerzhagen "High-speed singulation of electronic packages using a frequency-doubled Nd:YAG laser in a water jet and realization of a 200-W green laser", Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); https://doi.org/10.1117/12.478611

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
6 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Laser cutting

Copper

Nd:YAG lasers

Pulsed laser operation

Fiber lasers

Laser processing

Semiconductor lasers

Show All Keywords

Keywords/Phrases

Search In:

Publication Years