Paper
17 December 2003 New method for approaching the loading-free process for photomask Cr etching
Author Affiliations +
Abstract
In photomask manufacturing, etch loading effect is one of the most serious problems. The equal size of isolated clear patterns, each of which is surrounded by different pattern density, can show different CD (critical dimension) results after Cr etching process. Furthermore, as the feature size decreases and pattern density increase, the burden of Cr loading effect in mask fabrication is more enlarged than ever. In this paper, we will present the new method for approaching to the loading free process in photomask Cr dry etch.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Il-Yong Jang, Jeong-Yun Lee, Sung-Yong Moon, Seong-Woon Choi, and Jung-Min Sohn "New method for approaching the loading-free process for photomask Cr etching", Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); https://doi.org/10.1117/12.517842
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Etching

Chromium

Photomasks

Oxygen

Dry etching

Chlorine

Critical dimension metrology

RELATED CONTENT

Dry etching technologies for Cr film
Proceedings of SPIE (June 12 2018)
Chrome dry etching for 65-nm node mask manufacturing
Proceedings of SPIE (December 06 2004)
Improvement of chrome CDU by optimizing focus ring design
Proceedings of SPIE (August 28 2003)
Evaluation of loading effect of NLD dry etching
Proceedings of SPIE (July 19 2000)
Analysis of dry etch loading effect in mask fabrication
Proceedings of SPIE (March 11 2002)
Plasma monitoring of chrome dry etching for mask making
Proceedings of SPIE (September 24 2010)

Back to Top