Design and development of high etch rate organic bottom antireflective coating for sub-100 nm node and beyond

Hengpeng Wu; Zhong Xiang; Aritaka Hishida; David Abdallah; Jianhui Shan; Eleazar Gonzalez; Shuji S. Ding; Mark Neisser

doi:10.1117/12.537883

14 May 2004 Design and development of high-etch-rate organic bottom antireflective coating for sub-100-nm node and beyond

Hengpeng Wu, Zhong Xiang, Aritaka Hishida, David Abdallah, Jianhui Shan, Eleazar Gonzalez, Shuji S. Ding, Mark Neisser

Author Affiliations +

Proceedings Volume 5376, Advances in Resist Technology and Processing XXI; (2004) https://doi.org/10.1117/12.537883
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

As the semiconductor industry sails into the 100nm node and beyond, enabled by the integration of ArF lithography, new Bottom Antireflective Coatings (B.A.R.C.s) are required to address challenges associated with this new technology. Of these challenges, higher etch rates and better compatibility with the over coated resist are of central importance. New polymer platforms and additives in B.A.R.C. formulations will be required to overcome these challenges. The intent of this publication is to introduce our newly developed B.A.R.C.s designed to addresses the challenges of ArF lithography. All are currently available for integration into mass production of sub 100nm integrated circuit devices.

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Hengpeng Wu, Zhong Xiang, Aritaka Hishida, David Abdallah, Jianhui Shan, Eleazar Gonzalez, Shuji S. Ding, and Mark Neisser "Design and development of high-etch-rate organic bottom antireflective coating for sub-100-nm node and beyond", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); https://doi.org/10.1117/12.537883

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