Hybrid integration technologies for optical micro-systems

Eiji Higurashi; T. Itoh; Tadatomo Suga; R. Sawada

doi:10.1117/12.580079

25 October 2004 Hybrid integration technologies for optical micro-systems

Eiji Higurashi, T. Itoh, Tadatomo Suga, R. Sawada

Proceedings Volume 5604, Optomechatronic Micro/Nano Components, Devices, and Systems; (2004) https://doi.org/10.1117/12.580079
Event: Optics East, 2004, Philadelphia, Pennsylvania, United States

Abstract

Flip-chip bonding of various optical components on a silicon substrate by passive optical alignment, which eliminates complicated optical axis precise alignment, has opened up many new possibilities in constructing highly functional, reliable, and low-cost optical micro-systems. Using this technique several micro-sensors have been developed. Moreover, for future optical micro-systems, a novel method of a low temperature flip-chip bonding using surface activated bonding process has been introduced.

Citation Download Citation

Eiji Higurashi, T. Itoh, Tadatomo Suga, and R. Sawada "Hybrid integration technologies for optical micro-systems", Proc. SPIE 5604, Optomechatronic Micro/Nano Components, Devices, and Systems, (25 October 2004); https://doi.org/10.1117/12.580079

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