Solid state UV laser technology for electronic packaging applications

Weisheng Lei; John Davignon

doi:10.1117/12.571520

13 January 2005 Solid state UV laser technology for electronic packaging applications

Weisheng Lei, John Davignon

Proceedings Volume 5629, Lasers in Material Processing and Manufacturing II; (2005) https://doi.org/10.1117/12.571520
Event: Photonics Asia, 2004, Beijing, China

Abstract

This presentation introduces solid state UV laser drilling technology for electronic packaging applications which mainly includes generating microvias in high-density interconnects (HDI) printed wiring boards (PWB) and integrated circuit (IC) chip packaging devices. The first three sections discuss the drilling process technology in terms of substrate materials, via quality requirements, laser-materials interaction, via formation processes, laser beam profiles, and system hardware. The remaining sections cover some typical application examples including via drilling, soldermask ablation, and routing to explain the UV laser process capability with the common PWB materials.

Citation Download Citation

Weisheng Lei and John Davignon "Solid state UV laser technology for electronic packaging applications", Proc. SPIE 5629, Lasers in Material Processing and Manufacturing II, (13 January 2005); https://doi.org/10.1117/12.571520

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