VCSELs for high-speed data communication in TO packages: pushing the envelope

Ian Aeby; Lei Yang; Olga Lavrova; Hai Ling; Doug Collins; Charlie X. Wang; Chiyu Liu; Thomas Whittington

doi:10.1117/12.601936

14 March 2005 VCSELs for high-speed data communication in TO packages: pushing the envelope

Ian Aeby, Lei Yang, Olga Lavrova, Hai Ling, Doug Collins, Charlie X. Wang, Chiyu Liu, Thomas Whittington

Proceedings Volume 5737, Vertical-Cavity Surface-Emitting Lasers IX; (2005) https://doi.org/10.1117/12.601936
Event: Integrated Optoelectronic Devices 2005, 2005, San Jose, California, United States

Abstract

In this paper we report the results from on-going performance enhancements of Emcore's comprehensive line of data communication VCSEL products in cost effective hermetic TO packages. Data are presented on the -20 to 100°C temperature range operational characteristics of our offerings at 1.25, 2.5, 4, and 10 Gb/s. The discussion covers high-speed parameters, fiber coupling efficiency, and other important features of the packaged devices.

Citation Download Citation

Ian Aeby, Lei Yang, Olga Lavrova, Hai Ling, Doug Collins, Charlie X. Wang, Chiyu Liu, and Thomas Whittington "VCSELs for high-speed data communication in TO packages: pushing the envelope", Proc. SPIE 5737, Vertical-Cavity Surface-Emitting Lasers IX, (14 March 2005); https://doi.org/10.1117/12.601936

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