Paper
23 August 2005 High voltage series connected Si photovoltaic cells
Rupal K. Patel, Robert D. Nasby, David J. Stein, Alex H. Hsia, Reid S. Bennett
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Abstract
This report describes the features of monolithic, series connected silicon (Si) photovoltaic (PV) cells which have been developed for applications requiring higher voltages than obtained with conventional single junction solar cells. These devices are intended to play a significant role in micro / mini firing systems and fuzing systems for DOE and DOD applications. They are also appropriate for other applications (such as micro-electro-mechanical-systems (MEMS) actuation as demonstrated by Bellew et. al.) where electric power is required in remote regions and electrical connection to the region is unavailable or deemed detrimental for whatever reason. Our monolithic device consists of a large number of small PV cells, combined in series and fabricated using standard CMOS processing on silicon-on-insulator (SOI) wafers with 0.4 to 3 micron thick buried oxide (BOX) and top Si thickness of 5 and 10 microns. Individual cell isolation is achieved using the BOX layer of the SOI wafer on the bottom. Isolation along the sides is produced by trenching the top Si and subsequently filling the trench by deposition of dielectric films such as oxide, silicon nitride, or oxynitride. Multiple electrically isolated PV cells are connected in series to produce voltages ranging from approximately 0.5 volts for a single cell to several thousands of volts for strings of thousands of cells.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rupal K. Patel, Robert D. Nasby, David J. Stein, Alex H. Hsia, and Reid S. Bennett "High voltage series connected Si photovoltaic cells", Proc. SPIE 5871, Optical Technologies for Arming, Safing, Fuzing, and Firing, 58710F (23 August 2005); https://doi.org/10.1117/12.619527
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Cited by 1 scholarly publication.
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KEYWORDS
Silicon

Solar cells

Semiconducting wafers

Oxides

Etching

Absorption

Chemical mechanical planarization

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