New process for screen cutting: water-jet guided laser

Delphine Perrottet; Simone Amorosi; Bernold Richerzhagen

doi:10.1117/12.629058

29 July 2005 New process for screen cutting: water-jet guided laser

Delphine Perrottet, Simone Amorosi, Bernold Richerzhagen

Proceedings Volume 5961, Building European OLED Infrastructure; 596105 (2005) https://doi.org/10.1117/12.629058
Event: Workshop on Building European OLED Infrastructure, 2005, Cambridge, United Kingdom

Abstract

Today's OLED manufacturers need high-precision, fast tools to cut the metal screens used to deposit the electroluminescent layers onto the substrate. Conventional methods -tching and dry laser cutting - are not satisfying regarding the demands of high-definition OLED displays. A new micro machining technology, the water jet guided laser - a hybrid of laser and water jet technologies that has been actively used in recent years in the electronic and semiconductor field - is now available to OLED manufacturers. This technology represents a significant improvement in screen, mask and stencil cutting, as it combines high precision and high speed. It is able to cut small apertures with totally clean edges (no dross or slag), as the water jet removes the particles and a thin water film is maintained on the material surface during the process. Because the water jet cools the material between the laser pulses, the cut material is free of any thermal stress. The water jet guided laser is also a very fast process: as an example, rectangular slots can be cut in 30 to 50 microns thick stainless steel or nickel at a rate between 25'000 and 30'000 holes per hour.

Citation Download Citation

Delphine Perrottet, Simone Amorosi, and Bernold Richerzhagen "New process for screen cutting: water-jet guided laser", Proc. SPIE 5961, Building European OLED Infrastructure, 596105 (29 July 2005); https://doi.org/10.1117/12.629058

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