Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards

H. Schröder; J. Bauer; F. Ebling; M. Franke; A. Beier; P. Demmer; W. Süllau; J. Kostelnik; R. Mödinger; K. Pfeiffer; U. Ostrzinski; E. Griese

doi:10.1117/12.652759

3 March 2006 Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards

H. Schröder, J. Bauer, F. Ebling, M. Franke, A. Beier, P. Demmer, W. Süllau, J. Kostelnik, R. Mödinger, K. Pfeiffer, U. Ostrzinski, E. Griese

Author Affiliations +

Proceedings Volume 6124, Optoelectronic Integrated Circuits VIII; 612407 (2006) https://doi.org/10.1117/12.652759
Event: Integrated Optoelectronic Devices 2006, 2006, San Jose, California, United States

Abstract

Due to ever-faster processor clock speeds, there is a rising need for increased bandwidth to transfer large amounts of data, noise-free, within computer and telecommunications systems. A related requirement is the demand for high bit-rate, short-haul links. Here, optical transmission paths are a viable alternative to high-frequency electrical interconnections, whereby layers with integrated waveguides are particularly suitable. The reasons for this include that a higher connection density can be achieved and the power dissipation, as well as interference from electromagnetic radiation, are significantly lower. The article presents general considerations and the results of research conducted by the German BMBF Project NeGIT, into the manufacture of circuit boards with embedded polymer optical waveguides. The electrical-optical boards were fabricated using precise photolithographic processes and standard lamination methods. They possess the thermal stability necessary for manufacturing processes and operational conditions, in terms of both bond strength and the stability of the optical properties. As part of this project, a design of an optical coupling in the daughter card and board backplane interfaces was developed and is presented as the centerpiece of this study.

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H. Schröder, J. Bauer, F. Ebling, M. Franke, A. Beier, P. Demmer, W. Süllau, J. Kostelnik, R. Mödinger, K. Pfeiffer, U. Ostrzinski, and E. Griese "Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards", Proc. SPIE 6124, Optoelectronic Integrated Circuits VIII, 612407 (3 March 2006); https://doi.org/10.1117/12.652759

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