Paper
7 June 2006 Nanoparticle adhesion and removal studied by pulsed laser irradiation
Paul Leiderer, Michael Olapinski, Mario Mosbacher, Johannes Boneberg
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Abstract
The contactless removal of small particles from surfaces by irradiation with intense laser pulses - dubbed laser cleaning - has been used and studied for nearly two decades. Nevertheless, its applicability and the mechanisms involved are still under debate. Here we give first a brief overview on relevant processes, and then present measurements of the velocities of colloidal model particles after detachment under vacuum conditions. We also demonstrate a new Laser Cleaning approach, by which submicrometer particles are removed by laser irradiation of the rear side of the wafers. The particles are detached by an acoustic shock wave traveling to the wafer front side after laser ablation of the rear side. Not only is this promising approach capable of defect free surface cleaning, detailed studies of particle velocities versus laser fluence also allow insight into the different cleaning mechanisms involved. Furthermore, this technique could be applied to determine adhesion energies of particles in the future.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul Leiderer, Michael Olapinski, Mario Mosbacher, and Johannes Boneberg "Nanoparticle adhesion and removal studied by pulsed laser irradiation", Proc. SPIE 6261, High-Power Laser Ablation VI, 62610F (7 June 2006); https://doi.org/10.1117/12.675552
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Cited by 3 scholarly publications.
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KEYWORDS
Particles

Pulsed laser operation

Semiconducting wafers

Laser damage threshold

Laser ablation

Light scattering

Laser irradiation

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