Paper
19 October 2006 A boundary tracking approach for tape substrate pattern inspection based on skeleton information
Young Jun Roh, Seung Shin Ho, Cheol Woo Kim, Hyo Hyung Lee, Dae Hwa Jeong
Author Affiliations +
Abstract
Tape substrate (TS) product is a high-density circuit pattern on thin film substrate, and it requires precise and high resolution imaging system for inspection. We introduce here a TS inspection system developed, where the products are fed through a reel to reel system, and a series of inspection algorithms based on a referential method. In the system, it is so hard to achieve consistent images for such a thin and flexible materials as TS product that the images suffer from individual, local distortion during the image acquisition. Since the distortion results in relatively big discrepancy between an inspection image and the master one, direct image to image comparison approach is not available for inspection. To inspect the pattern in a more robust way in this application, we propose a graph matching method where the patterns are modeled as a collection of lines with link points as features. In the offline teaching process, the graph model is achieved from skeleton of the master image, which is collected as a data base. In the run time, a boundary tracking method is used for extracting the graph model from an inspection image instead of a skeleton process to reduce the computation time. By comparing the corresponding graph models, a line that is linked to undesired endpoints can be detected, which becomes an open or short defect. Through boundary tracking approach, we can also detect boundary defects such as pattern nick and protrusions as well.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Young Jun Roh, Seung Shin Ho, Cheol Woo Kim, Hyo Hyung Lee, and Dae Hwa Jeong "A boundary tracking approach for tape substrate pattern inspection based on skeleton information", Proc. SPIE 6375, Optomechatronic Sensors, Instrumentation, and Computer-Vision Systems, 63750P (19 October 2006); https://doi.org/10.1117/12.686444
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KEYWORDS
Inspection

Image processing

Defect detection

Distortion

Feature extraction

Image registration

Binary data

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