MOEMS development of infrared security sensors

Kevin C. Liddiard

doi:10.1117/12.695680

8 January 2007 MOEMS development of infrared security sensors

Kevin C. Liddiard

Proceedings Volume 6414, Smart Structures, Devices, and Systems III; 641417 (2007) https://doi.org/10.1117/12.695680
Event: SPIE Smart Materials, Nano- and Micro-Smart Systems, 2006, Adelaide, Australia

Abstract

This paper discusses progress in the development of a new generation of passive infrared (PIR) security sensors for the high volume military, industrial and consumer markets. Recent work on patented sensor technology is described, including the mosaic pixel focal plane array concept (MP-FPA), which enables enhanced sensor performance to be achieved with low cost optics and cheap packaging. MOEMS technology is employed for fabrication of silicon microbolometer detector arrays, which are integrated on-chip with a CMOS readout integrated circuit, and can be fabricated by large scale production methods in a silicon-based MEMS foundry. The paper addresses the application of this technology to PIR security sensors.

Citation Download Citation

Kevin C. Liddiard "MOEMS development of infrared security sensors", Proc. SPIE 6414, Smart Structures, Devices, and Systems III, 641417 (8 January 2007); https://doi.org/10.1117/12.695680

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