Double exposure using 193-nm negative tone photoresist

Ryoung-han Kim; Tom Wallow; Jongwook Kye; Harry J. Levinson; Dave White

doi:10.1117/12.713209

26 March 2007 Double exposure using 193nm negative tone photoresist

Ryoung-han Kim, Tom Wallow, Jongwook Kye, Harry J. Levinson, Dave White

Proceedings Volume 6520, Optical Microlithography XX; 65202M (2007) https://doi.org/10.1117/12.713209
Event: SPIE Advanced Lithography, 2007, San Jose, California, United States

Abstract

Double exposure is one of the promising methods for extending lithographic patterning into the low k₁ regime. In this paper, we demonstrate double patterning of k_1-effective=0.25 with improved process window using a negative resist. Negative resist (TOK N- series) in combination with a bright field mask is proven to provide a large process window in generating 1:3 = trench:line resist features. By incorporating two etch transfer steps into the hard mask material, frequency doubled patterns could be obtained.

Citation Download Citation

Ryoung-han Kim, Tom Wallow, Jongwook Kye, Harry J. Levinson, and Dave White "Double exposure using 193nm negative tone photoresist", Proc. SPIE 6520, Optical Microlithography XX, 65202M (26 March 2007); https://doi.org/10.1117/12.713209

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