Technology development for micromirror arrays with high optical fill factor and stable analogue deflection integrated on CMOS substrates

Jan-Uwe Schmidt; Martin Friedrichs; Thor Bakke; Benjamin Voelker; Dirk Rudloff; Hubert Lakner

doi:10.1117/12.787015

25 April 2008 Technology development for micromirror arrays with high optical fill factor and stable analogue deflection integrated on CMOS substrates

Jan-Uwe Schmidt, Martin Friedrichs, Thor Bakke, Benjamin Voelker, Dirk Rudloff, Hubert Lakner

Author Affiliations +

Proceedings Volume 6993, MEMS, MOEMS, and Micromachining III; 69930D (2008) https://doi.org/10.1117/12.787015
Event: SPIE Photonics Europe, 2008, Strasbourg, France

Abstract

At Fraunhofer IPMS Dresden micromechanical mirror arrays are developed and fabricated using a high-voltage CMOS process for applications such as lithographic mask writers and adaptive optics. Different approaches for the fabrication of micromechanical mirror arrays with up to 1 million analogue addressable pixels in a MEMS-on-CMOS technology are discussed: sacrificial layer technologies of 1-level actuators made from a single Al-TiAl-Al structural multilayer or 2-level actuators with an additional TiAl hinge layer respectively. Also the fabrication of single crystalline Si micro-mirrors using layer-transfer bonding is discussed.

Citation Download Citation

Jan-Uwe Schmidt, Martin Friedrichs, Thor Bakke, Benjamin Voelker, Dirk Rudloff, and Hubert Lakner "Technology development for micromirror arrays with high optical fill factor and stable analogue deflection integrated on CMOS substrates", Proc. SPIE 6993, MEMS, MOEMS, and Micromachining III, 69930D (25 April 2008); https://doi.org/10.1117/12.787015

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