Pulsed laser breaking technique for glass substrates

Chwan-Huei Tsai; Wei-Han Chang

doi:10.1117/12.809728

23 February 2009 Pulsed laser breaking technique for glass substrates

Chwan-Huei Tsai, Wei-Han Chang

Proceedings Volume 7204, Micromachining and Microfabrication Process Technology XIV; 72040A (2009) https://doi.org/10.1117/12.809728
Event: SPIE MOEMS-MEMS: Micro- and Nanofabrication, 2009, San Jose, California, United States

Abstract

The aim of this paper is to present the pulsed laser breaking technique, a technique that further builds on the unstable fracture technique. In this study, a diamond-point scoring tool was used to scribe a groove and create a median crack (grooved-crack) along the cutting path in a glass substrate. A pulsed CO2 laser was then applied at the cutting path to cut the glass substrate. A crack developed in the grooved-crack after the first laser pulse, increased in length after the second pulse, and then extended unstably after the third. The scribed grooved-crack determined the direction of crack propagation. The glass substrate separated along the scribed path. The surface of the separated pieces was free of microcracks common to mechanical breaking. The scribe force and groove depth were established and the laser parameters were set. Photographs of the glass substrate surface were obtained to analyze the cutting quality. An image processing system of crack detection was employed to obtain the crack image continuously during the laser breaking process. The stress analyses via ANSYS were performed to explain the mechanism of the breaking process that has been successfully developed in this study on cutting LCD glass substrates.

Citation Download Citation

Chwan-Huei Tsai and Wei-Han Chang "Pulsed laser breaking technique for glass substrates", Proc. SPIE 7204, Micromachining and Microfabrication Process Technology XIV, 72040A (23 February 2009); https://doi.org/10.1117/12.809728

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