Paper
23 March 2009 Multi-purpose optical profiler for characterization of materials, film stacks, and for absolute topography measurement
X. Colonna de Lega, Martin Fay, Peter de Groot, Boris Kamenev, J. Ryan Kruse, Mitch Haller, Mark Davidson, Lena Miloslavsky, Duncan Mills
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Abstract
We have developed a scanning white-light interference microscope that offers two complementary modes of operation on a common metrology platform. The first mode measures the topography and the second mode measures the complex reflectivity of an object surface over a range of wavelengths, angles of incidence and polarization states. This second mode characterizes material optical properties and determines film thickness in multi-layer film stacks with an effective measurement spot size typically smaller than 10 μm. These data compensate for material and film effects in the surface topography data collected in the first mode. We illustrate the application of this dual-mode technology for post-CMP production-line metrology for the data storage industry. Our tool concurrently measures critical layer thickness and step height for this application. The accuracy of the latter measurement is confirmed by correlation to AFM measurements.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
X. Colonna de Lega, Martin Fay, Peter de Groot, Boris Kamenev, J. Ryan Kruse, Mitch Haller, Mark Davidson, Lena Miloslavsky, and Duncan Mills "Multi-purpose optical profiler for characterization of materials, film stacks, and for absolute topography measurement", Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72723Z (23 March 2009); https://doi.org/10.1117/12.814629
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Cited by 3 scholarly publications.
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KEYWORDS
Metrology

Data modeling

Oxides

Microscopes

Reflectivity

Semiconducting wafers

3D metrology

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