Paper
24 November 2009 Motion blurred image restoration algorithm for IC wire bonder
Yixin Zhang, Shun Wang, Xuping Zhang, Xuejun Lu
Author Affiliations +
Abstract
Chip packaging is an important process during IC manufacturing. Wire bonders are key equipments of chip packaging. The manually type of wire bonders can be updated to automatic with a pattern recognition system (PRS). However, the resolution of PRS is quite sensitive to the mechanism's trembling. Additional waiting time has to be taken before the image sensor can take a shoot, which limits the wire bonder's productivity. In this paper, method for motion blurred image restoration is presented. The method uses point spread function (PSF) learning to estimate the degradation function and power spectrum analyze to estimate the image's signal to noise rate (SNR). Experimental results are given to illustrate the proposed image restoration algorithm.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yixin Zhang, Shun Wang, Xuping Zhang, and Xuejun Lu "Motion blurred image restoration algorithm for IC wire bonder", Proc. SPIE 7513, 2009 International Conference on Optical Instruments and Technology: Optoelectronic Imaging and Process Technology, 75130C (24 November 2009); https://doi.org/10.1117/12.838152
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Cited by 4 scholarly publications.
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KEYWORDS
Image restoration

Point spread functions

Signal to noise ratio

Image processing

Filtering (signal processing)

Image filtering

Image sensors

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