Research on thermal characteristics of electronic devices using thermal microscopes

Lu Gao; Jihui Wang; Weiqi Jin; Xingdao He

doi:10.1117/12.869621

4 November 2010 Research on thermal characteristics of electronic devices using thermal microscopes

Lu Gao, Jihui Wang, Weiqi Jin, Xingdao He

Proceedings Volume 7854, Infrared, Millimeter Wave, and Terahertz Technologies; 78543I (2010) https://doi.org/10.1117/12.869621
Event: Photonics Asia 2010, 2010, Beijing, China

Abstract

Electronic devices are widely used in various industries, their temperature distribution cannot be obtained by traditional test methods. In recent years, simulation softwares are used to simulate the thermal characteristics of electronic devices and play a positive role on the reliability improvement, on the contrast, their validity cannot be verified. In this paper, the chip temperature rise process is simulated by ICEPEAK software. Some factors that change thermal characteristics are analyzed. The actual working temperature obtained by the thermal microscope is compared with the simulation temperature. The validity of simulation temperature is tested and the relation is built between the actual temperature and simulation temperature. Finally, it is pointed that thermal microscopes are the development direction on the electronic devices design and reliability testing.

Citation Download Citation

Lu Gao, Jihui Wang, Weiqi Jin, and Xingdao He "Research on thermal characteristics of electronic devices using thermal microscopes", Proc. SPIE 7854, Infrared, Millimeter Wave, and Terahertz Technologies, 78543I (4 November 2010); https://doi.org/10.1117/12.869621

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