Paper
11 November 2010 Profile measurement based on spectral interferometer with multi-wavelength back-propagation methods
Kohei Otsuki, Samuel Choi, Osami Sasaki, Takamasa Suzuki
Author Affiliations +
Abstract
The multi-wavelength back-propagation (MWB) method enables to determine precisely the optical path different (OPD) longer than the optical wavelength from detecting the amplitude and phase of the interference signal for the multiple wavelengths. In this study, we demonstrate a 1-dimensional thickness profile measurement by the MWB and sinusoidal phase modulation (SPM) technique with a spectral interferometer. The OPD for the front and rear reflecting surfaces of a glass film with the thickness of 100 μm are measured. The thickness profile is successfully measured with repeatability of 2 nm estimated from a standard error between 9 repeatedly-measured profiles.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kohei Otsuki, Samuel Choi, Osami Sasaki, and Takamasa Suzuki "Profile measurement based on spectral interferometer with multi-wavelength back-propagation methods", Proc. SPIE 7855, Optical Metrology and Inspection for Industrial Applications, 78550R (11 November 2010); https://doi.org/10.1117/12.870987
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Cited by 1 scholarly publication and 4 patents.
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KEYWORDS
Interferometers

Scanning probe microscopy

Glasses

Mirrors

Charge-coupled devices

Interferometry

Signal detection

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