Package technology for microcavities

Wen-Dong Zhang; Ying-Zhan Yan; Jun Liu; Shu-Bin Yan; Chen-Yang Xue; Ji-Jun Xiong

doi:10.1117/12.893474

27 September 2011 Package technology for microcavities

Wen-Dong Zhang, Ying-Zhan Yan, Jun Liu, Shu-Bin Yan, Chen-Yang Xue, Ji-Jun Xiong

Proceedings Volume 8126, Optical Manufacturing and Testing IX; 81261G (2011) https://doi.org/10.1117/12.893474
Event: SPIE Optical Engineering + Applications, 2011, San Diego, California, United States

Abstract

Although Microcavities are promising in a variety of novel devices, there is slow development in microcavity based practical devices due to the lack of the package technology. In this paper, for the first time, we demonstrate the package technology for the microcavity coupling system to promote the development of the microcavity based practical applications. The package process are illustrated in detail. The changes which result from the package are also discussed. In addition, the advantages of the packaged structure are characterized, including the Q maintenance, robustness and the convenience. These advantages make this packaged structure promising in microcavity based practical devices.

Citation Download Citation

Wen-Dong Zhang, Ying-Zhan Yan, Jun Liu, Shu-Bin Yan, Chen-Yang Xue, and Ji-Jun Xiong "Package technology for microcavities", Proc. SPIE 8126, Optical Manufacturing and Testing IX, 81261G (27 September 2011); https://doi.org/10.1117/12.893474

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