Paper
8 November 2012 Improving CD uniformity using MB-MDP for 14nm node and beyond
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Abstract
Model-Based Mask Data Preparation (MB-MDP) has been discussed in the literature for its benefits in reducing mask write times [1][2]. By being model based (i.e., simulation based), overlapping shots, per-shot dose modulation, and circular and other character projection shots are enabled. This reduces variable shaped beam (VSB) shot count for complex mask shapes, and particularly ideal ILT shapes [3]. In this paper, the authors discuss another even more important aspect of MB-MDP. MB-MDP enhances CD Uniformity (CDU) on the mask, and therefore on the wafer. Mask CDU is improved for sub-80nm features on mask through the natural increase in dose that overlapping provides, and through per-shot dose modulation. The improvement in CDU is at the cost of some write times for the less complex EUV masks with only rectangular features. But these masks do not have the basis of large write times that come from complex SRAFs. For ArF masks for the critical layers at the 20nm logic node and below, complex SRAFs are unavoidable. For these shapes, MB-MDP enhances CDU while simultaneously reducing write times. Simulated and measured comparison of conventional methodology and MB-MDP methodology are presented.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Byung Gook Kim, Jin Choi, Jisoong Park, Chan Uk Jeon, Sterling Watson, Anthony Adamov, Bob Pack, and Ingo Bork "Improving CD uniformity using MB-MDP for 14nm node and beyond", Proc. SPIE 8522, Photomask Technology 2012, 852205 (8 November 2012); https://doi.org/10.1117/12.966327
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CITATIONS
Cited by 7 scholarly publications.
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KEYWORDS
Photomasks

Semiconducting wafers

Monte Carlo methods

Data modeling

Critical dimension metrology

Backscatter

Lithography

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