Design of vertical packaging technology for RF MEMS switch

Deepak Bansal; Akshdeep Sharma; Maninder Kaur; K. J. Rangra

doi:10.1117/12.924260

15 October 2012 Design of vertical packaging technology for RF MEMS switch

Deepak Bansal, Akshdeep Sharma, Maninder Kaur, K. J. Rangra

Proceedings Volume 8549, 16th International Workshop on Physics of Semiconductor Devices; 854911 (2012) https://doi.org/10.1117/12.924260
Event: 16th International Workshop on Physics of Semiconductor Devices, 2011, Kanpur, India

Abstract

Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This article presents an approach for design and processing steps related to encapsulation of individual RF components e.g. CPW, RF MEMS switches, in view of the variation in performance subsequent to packaging. Bottom contact vertical packaging is more prone to misalignment margin and easy to make connections. Cavity height of 30 µm is optimized for bottom contact vertical packaging.

Citation Download Citation

Deepak Bansal, Akshdeep Sharma, Maninder Kaur, and K. J. Rangra "Design of vertical packaging technology for RF MEMS switch", Proc. SPIE 8549, 16th International Workshop on Physics of Semiconductor Devices, 854911 (15 October 2012); https://doi.org/10.1117/12.924260

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