Silver-Polypyrrole-Silver structure fabrication and characterization over wide temperature

Manish Taunk; Subhash Chand

doi:10.1117/12.927360

15 October 2012 Silver-polypyrrole-silver structure fabrication and characterization over wide temperature

Manish Taunk, Subhash Chand

Proceedings Volume 8549, 16th International Workshop on Physics of Semiconductor Devices; 854934 (2012) https://doi.org/10.1117/12.927360
Event: 16th International Workshop on Physics of Semiconductor Devices, 2011, Kanpur, India

Abstract

Semiconducting polymers have applications in many electronic devices such as organic light emitting diodes, organic solar cells, field effect transistors, memory devices, and many flexible electronic devices. In the organic electronic devices, metal-organic semiconductor interface plays a major role in determining the electrical transport. Earlier most of the studies were performed on electrochemically polymerized polypyrrole. In this study polypyrrole-poly(vinylidene) fluoride composite films synthesized by chemical oxidation method were used for contact fabrication in sandwiched geometry. Electrical transport measurements have been carried out in silver-polypyrrole-silver sandwich structure to understand conduction mechanism in the temperature range of 10-300K. It has been observed that Ag forms Ohmic contact with PPy and bulk controlled space charge limited conduction was the dominant current transport process in these sandwiched structures.

Citation Download Citation

Manish Taunk and Subhash Chand "Silver-polypyrrole-silver structure fabrication and characterization over wide temperature", Proc. SPIE 8549, 16th International Workshop on Physics of Semiconductor Devices, 854934 (15 October 2012); https://doi.org/10.1117/12.927360

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