Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating

Akira Watanabe

doi:10.1117/12.2001848

15 March 2013 Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating

Akira Watanabe

Proceedings Volume 8608, Laser-based Micro- and Nanopackaging and Assembly VII; 86080O (2013) https://doi.org/10.1117/12.2001848
Event: SPIE LASE, 2013, San Francisco, California, United States

Abstract

The laser sintering of gold nanoparticles on a copper substrate was studied to develop an alternative to gold plating. The major problem in the gold coating on a copper substrate using gold nanoparticle ink is that copper atom easily diffuses to the surface through the gold layer and to form an oxide layer during the thermal sintering of gold nanoparticles. The depth profile of elemental composition of laser-sintered gold layer showed that the effective reduction of the diffusion of copper atom through the gold layer is possible because the laser sintering of metal nanoparticles is extremely fast process due to the nano-heater effect caused by the laser excitation of plasmon band.

Citation Download Citation

Akira Watanabe "Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating", Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080O (15 March 2013); https://doi.org/10.1117/12.2001848

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