Paper
11 June 2013 Low-cost compact thermal imaging sensors for body temperature measurement
Myung-Soo Han, Seok Man Han, Hyo Jin Kim, Jae Chul Shin, Mi Sook Ahn, Hyung Won Kim, Yong Hee Han
Author Affiliations +
Abstract
This paper presents a 32x32 microbolometer thermal imaging sensor for human body temperature measurement. Waferlevel vacuum packaging technology allows us to get a low cost and compact imaging sensor chip. The microbolometer uses V-W-O film as sensing material and ROIC has been designed 0.35-um CMOS process in UMC. A thermal image of a human face and a hand using f/1 lens convinces that it has a potential of human body temperature for commercial use.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Myung-Soo Han, Seok Man Han, Hyo Jin Kim, Jae Chul Shin, Mi Sook Ahn, Hyung Won Kim, and Yong Hee Han "Low-cost compact thermal imaging sensors for body temperature measurement", Proc. SPIE 8704, Infrared Technology and Applications XXXIX, 87041O (11 June 2013); https://doi.org/10.1117/12.2015662
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Thermography

Semiconducting wafers

Sensors

Infrared sensors

Bolometers

Microbolometers

Wafer bonding

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