Shyam S. Bayya,1 Guillermo R. Villalobos,1 Michael P. Hunt,2 Jasbinder S. Sanghera,1 Bryan M. Sadowski,3 Ishwar D. Aggarwal,3 Michael Cinibulk,4 Carmen Carney,5 Kristin Keller5
1U.S. Naval Research Lab. (United States) 2University Research Foundation (United States) 3Sotera Defense Solutions, Inc. (United States) 4Air Force Research Lab. (United States) 5UES, Inc. (United States)
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Transparent beta-SiC is of great interest because its high strength, low coefficient of thermal expansion, very high thermal conductivity, and cubic crystal structure give it a very high thermal shock resistance. A transparent, polycrystalline beta-SiC window will find applications in armor, hypersonic missiles, and thermal control for thin disc lasers. SiC is currently available as either small transparent vapor grown disks or larger opaque shapes. Neither of which are useful in window applications. We are developing sintering technology to enable transparent SiC ceramics. This involves developing procedures to make high purity powders and studying their densification behavior. We have been successful in demonstrating transparency in thin sections using Field Assisted Sintering Technology (FAST). This paper will discuss the reaction mechanisms in the formation of beta-SiC powder and its sintering behavior in producing transparent ceramics.
Shyam S. Bayya,Guillermo R. Villalobos,Michael P. Hunt,Jasbinder S. Sanghera,Bryan M. Sadowski,Ishwar D. Aggarwal,Michael Cinibulk,Carmen Carney, andKristin Keller
"Development of transparent polycrystalline beta-silicon carbide", Proc. SPIE 8837, Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems, 88370S (30 September 2013); https://doi.org/10.1117/12.2023954
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Shyam S. Bayya, Guillermo R. Villalobos, Michael P. Hunt, Jasbinder S. Sanghera, Bryan M. Sadowski, Ishwar D. Aggarwal, Michael Cinibulk, Carmen Carney, Kristin Keller, "Development of transparent polycrystalline beta-silicon carbide," Proc. SPIE 8837, Material Technologies and Applications to Optics, Structures, Components, and Sub-Systems, 88370S (30 September 2013); https://doi.org/10.1117/12.2023954