Efficient grinding and polishing processes for asphere manufacturing

Markus Hinn; Alex Pisarski

doi:10.1117/12.2028888

15 October 2013 Efficient grinding and polishing processes for asphere manufacturing

Markus Hinn, Alex Pisarski

Proceedings Volume 8884, Optifab 2013; 88840I (2013) https://doi.org/10.1117/12.2028888
Event: SPIE Optifab, 2013, Rochester, New York, United States

Abstract

The increasing use of aspheres in a variety of optical systems has pushed the industry to become more efficient at its manufacturing processes. Non-optimized grinding techniques can cause excessive sub-surface damage and mid-spatial frequency errors which can be both time consuming and difficult to remove during polishing. The SCGa 100 grinder and SCPa 100 polisher provide unique platforms for asphere manufacturing. The SCGa 100 uses optimized kinematics to create a stiff and rigid platform which minimizes grinding errors and artifacts. Subsequently, polishing time on the SCPa 100 is decreased reducing the risk of altering the aspheric shape. This process improves surface quality while simplifying manufacturing.

Citation Download Citation

Markus Hinn and Alex Pisarski "Efficient grinding and polishing processes for asphere manufacturing", Proc. SPIE 8884, Optifab 2013, 88840I (15 October 2013); https://doi.org/10.1117/12.2028888

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