Optimized MCT IR-modules for high-performance imaging applications

R. Breiter; D. Eich; H. Figgemeier; H. Lutz; J. Wendler; I. Rühlich; S. Rutzinger; T. Schallenberg

doi:10.1117/12.2050731

24 June 2014 Optimized MCT IR-modules for high-performance imaging applications

R. Breiter, D. Eich, H. Figgemeier, H. Lutz, J. Wendler, I. Rühlich, S. Rutzinger, T. Schallenberg

Proceedings Volume 9070, Infrared Technology and Applications XL; 90702V (2014) https://doi.org/10.1117/12.2050731
Event: SPIE Defense + Security, 2014, Baltimore, MD, United States

Abstract

In today’s typical military operations situational awareness is a key element for mission success. In contrast to what is known from conventional warfare with typical targets such as tanks, asymmetric scenarios now dominate military operations. These scenarios require improved identification capabilities, for example the assessment of threat levels posed by personnel targets. Also, it is vital to identify and reliably distinguish between combatants, non-combatants and friendly forces. To satisfy these requirements, high-definition (HD) large format systems are well suited due to their high spatial and thermal resolution combined with high contrast. Typical applications are sights for long-range surveillance, targeting and reconnaissance platforms as well as rotorcraft pilotage sight systems. In 2012 AIM presented first prototypes of large format detectors with 1280 × 1024 elements in a 15μm pitch for both spectral bands MWIR and LWIR. The modular design allows integration of different cooler types, like AIM’s split linear coolers SX095 or SX040 or rotary integral types depending whatever fits best to the application. Large format FPAs have been fabricated using liquid phase epitaxy (LPE) or molecular beam epitaxy (MBE) grown MCT. To offer high resolution in a more compact configuration AIM started the development of a 1024 × 768 10μm pitch IRmodule. Keeping electro/optical performance is achieved by a higher specific charge handling capacity of the readout integrated circuit (ROIC) in a 0.18μm Si CMOS technology. The FPA size fits to a dewar cooler configuration used for 640 × 512 15μm pitch modules.

Citation Download Citation

R. Breiter, D. Eich, H. Figgemeier, H. Lutz, J. Wendler, I. Rühlich, S. Rutzinger, and T. Schallenberg "Optimized MCT IR-modules for high-performance imaging applications", Proc. SPIE 9070, Infrared Technology and Applications XL, 90702V (24 June 2014); https://doi.org/10.1117/12.2050731

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