Multi-beam SEM technology for ultra-high throughput

Thomas Kemen; Tomasz Garbowski; Dirk Zeidler

doi:10.1117/12.2195705

9 July 2015 Multi-beam SEM technology for ultra-high throughput

Thomas Kemen, Tomasz Garbowski, Dirk Zeidler

Proceedings Volume 9658, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII; 965807 (2015) https://doi.org/10.1117/12.2195705
Event: Photomask Japan 2015, 2015, Yokohama, Japan

Abstract

E-beam based technologies are widely used for metrology applications in both wafer fabs and mask shops due to their intrinsic high resolution capabilities. However, the throughput requirements for defect inspection are orders of magnitude higher than what is traditionally achievable with electron beam technologies. We have developed a novel multi-electron beam based technology to address the existing need for high speed imaging of nanoscale patterns. This technique enables ultra-high image acquisition rates which scale with the number of electron beams. In this article the technology development status and imaging results will be shown, including first results with the multi-beam SEM on EUV masks.

Citation Download Citation

Thomas Kemen, Tomasz Garbowski, and Dirk Zeidler "Multi-beam SEM technology for ultra-high throughput", Proc. SPIE 9658, Photomask Japan 2015: Photomask and Next-Generation Lithography Mask Technology XXII, 965807 (9 July 2015); https://doi.org/10.1117/12.2195705

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