CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 9779 > Article
Paper
25 March 2016 Contact/Via placement management for N7 logic and beyond
Kenichi Oyama, Arisa Hara, Kyohei Koike, Masatoshi Yamato, Shohei Yamauchi, Sakurako Natori, Hidetami Yaegashi
Author Affiliations +
Proceedings Volume 9779, Advances in Patterning Materials and Processes XXXIII; 97790M (2016) https://doi.org/10.1117/12.2218976
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States
Abstract
The continuously scaling of complex device geometries is driving by the self-aligned multiple patterning techniques. Depending on such simplified LS scaling, FinFET design rule has been accelerated to unidirectional design layout. [1] In particular Fin, Gate and Metal layers are based on grating with cutting/blocking scheme, these process have become high volume manufacturing techniques in N14 and beyond.[2,3] On the other hand, immersions based pitch scaling of contact hole, via and cutmask processes are required multiple lithography and etching passes.[4] Overlay management is not only the overlay accuracy of layer to layer, to determine the placement error and patterning fidelity in single layer. In this work, focusing on the placement in hole pattern, total placement error budget will be discussed from the viewpoints of metrology, inspection, Mask, OPC and wafer processing. In addition, hole shrink and hole healing techniques have more significant factors in terms of design-process technology co-optimization for N7 and beyond.[5]
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Kenichi Oyama, Arisa Hara, Kyohei Koike, Masatoshi Yamato, Shohei Yamauchi, Sakurako Natori, and Hidetami Yaegashi "Contact/Via placement management for N7 logic and beyond", Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97790M (25 March 2016); https://doi.org/10.1117/12.2218976
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 9 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Optical lithography
Etching
Photoresist processing
Logic
Photomasks
Lithography
Reactive ion etching
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top