The study on quantifiable analysis for complex OPCed patterns based on Mask CD SEM contour information

Won Joo Park; Hyung-Joo Lee; Yoon Taek Han; Seuk Hwan Choi; Hak Seung Han; Dong Hoon Chung; Chan-Uk Jeon; Yoshiaki Ogiso; Soichi Shida; Jun Matsumoto; Takayuki Nakamura

doi:10.1117/12.2242496

10 May 2016 The study on quantifiable analysis for complex OPCed patterns based on Mask CD SEM contour information

Won Joo Park, Hyung-Joo Lee, Yoon Taek Han, Seuk Hwan Choi, Hak Seung Han, Dong Hoon Chung, Chan-Uk Jeon, Yoshiaki Ogiso, Soichi Shida, Jun Matsumoto, Takayuki Nakamura

Author Affiliations +

Proceedings Volume 9984, Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology; 998407 (2016) https://doi.org/10.1117/12.2242496
Event: Photomask Japan 2016, 2016, Yokohama, Japan

Abstract

As the design rule becomes continuously smaller, the Hard OPC is being applied to pattern design in semiconductor production. Controllability of hard OPCed pattern’s quality directly affects to the performance of the device and yields of production. Critical Dimension Scanning Electron Microscopy (CD-SEM) is used to accurately confirm the Critical Dimension (CD) quality of the photomask. CD-SEM makes the pattern’s shape image by using secondary electrons information directly from the Mask surface and can measure CD values. Classically the purpose of CD-SEM measurement was to get one dimensional CD values. However it is difficult to guarantee complex hard OPCed pattern’s quality by using only one dimensional CD values because complexity of pattern design has been increased. To confirm and control the quality of hard OPCed pattern, the quality of pattern fidelity must be measured quantitatively. In order to overcome this difficulty we developed a new method to quantitatively evaluate the quality of pattern fidelity using EPE (Edge Placement Error) distance from the overlay between Target Design GDS and SEM GDS contour which is extracted from CD-SEM image. This paper represents how to define and analyze quantitatively the quality of complex hard OPCed pattern.

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Won Joo Park, Hyung-Joo Lee, Yoon Taek Han, Seuk Hwan Choi, Hak Seung Han, Dong Hoon Chung, Chan-Uk Jeon, Yoshiaki Ogiso, Soichi Shida, Jun Matsumoto, and Takayuki Nakamura "The study on quantifiable analysis for complex OPCed patterns based on Mask CD SEM contour information", Proc. SPIE 9984, Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology, 998407 (10 May 2016); https://doi.org/10.1117/12.2242496

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KEYWORDS

Photomasks

Critical dimension metrology

Scanning electron microscopy

Metrology

Image processing

Statistical analysis

Image quality

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