Flexible electronic devices composed of polymers and elastomers require high mechanical durability to maintain their performance during cyclic bending. To design the appropriate structure for such devices, it is important to identify the position of a neutral mechanical plane (NMP) where there is no strain inside a bending material. In this study, the NMP position of bending polydimethylsiloxane (PDMS) film, which is a common soft material used in flexible electronic devices, is experimentally identified through internal strain measurement using a cholesteric liquid crystal sensor. Notably, the NMP of the bending PDMS film reversibly shifts toward the inner bending surface. Further, considering the NMP shifting enables us to fabricate a flexible electronic device with high mechanical durability. Quantifying the NMP position facilitates the development of device designs for flexible electronics.
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