Why use ultrashort pulsed lasers for laser microwelding of dissimilar materials

Dimitris Karnakis; Etienne Pelletier

doi:10.1117/12.3016744

20 June 2024 Why use ultrashort pulsed lasers for laser microwelding of dissimilar materials

Dimitris Karnakis, Etienne Pelletier

Proceedings Volume PC13005, Laser + Photonics for Advanced Manufacturing ; PC1300507 (2024) https://doi.org/10.1117/12.3016744
Event: SPIE Photonics Europe, 2024, Strasbourg, France

Abstract

We will present recent advances in direct bonding of dissimilar materials like glass to metal, silicon or ceramics using ultrashort lasers. The process can potentially displace traditional bonding techniques such as epoxy, diffusion, anodic, etc offering a clean, fast and flexible new alternative. It relies on highly controlled laser heat input from <10ps pulses along a user-defined toolpath at the material interface and has been proven to work on various material combinations including BK7, quartz, fused silica, sapphire glasses of varying size, thickness and shape with metals (aluminium, s.steel, titanium, etc), silicon and ceramics (silicon nitride).

Conference Presentation

Citation Download Citation

Dimitris Karnakis and Etienne Pelletier "Why use ultrashort pulsed lasers for laser microwelding of dissimilar materials", Proc. SPIE PC13005, Laser + Photonics for Advanced Manufacturing , PC1300507 (20 June 2024); https://doi.org/10.1117/12.3016744

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