Presentation
10 June 2024 Quantum integrated photonics chips and packaging
Author Affiliations +
Abstract
Quantum Photonic Integrated Circuits (Q-PICs) chips are playing a pivotal role in achieving the dense integration necessary for scalable quantum technologies. In this talk, I will introduce essential Q-PIC components, notably nonlinear waveguide photon sources that operate across a broad spectrum, extending from visible to telecom wavelengths. I will also delve into the development of efficient circuitry for manipulating photonic qubits, in particular, thermo-optic phase shifters that operate using just a milliWatt and high performance Silicon electro-optic modulators. I will also discuss the packaging of Q-PICs, in particular, low-loss fiber-to-chip coupling, flip-chip integration with electronic interconnects and heterogeneous integration of nonlinear and III-V materials using Micro-Transfer Printing and Photonic Wire Bonding.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stefan F. Preble "Quantum integrated photonics chips and packaging", Proc. SPIE PC13028, Quantum Information Science, Sensing, and Computation XVI, PC130280F (10 June 2024); https://doi.org/10.1117/12.3021843
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