Open Access
27 January 2024 Special Section Guest Editorial: Packaging Challenges of Photonic Integrated Circuits
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Abstract

Guest Editors Jeroen Missinne, Yanlu Li, Stefan Mohrdiek, and Padraic Morrissey introduce the Special Section on Packaging Challenges of Photonic Integrated Circuits.

© 2024 Society of Photo-Optical Instrumentation Engineers (SPIE)
Jeroen Missinne, Yanlu Li, Stefan Mohrdiek, and Padraic Morrissey "Special Section Guest Editorial: Packaging Challenges of Photonic Integrated Circuits," Journal of Optical Microsystems 4(1), 011001 (27 January 2024). https://doi.org/10.1117/1.JOM.4.1.011001
Published: 27 January 2024
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KEYWORDS
Photonic integrated circuits

Packaging

Advanced packaging

Optical testing

Optical components

Optical fabrication

Optical microsystems

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