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18 March 2024 Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic–electronic transceivers (Erratum)
David Coenen, Minkyu Kim, Herman Oprins, Yoojin Ban, Dimitrios Velenis, Joris Van Campenhout, Ingrid De Wolf
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Journal of Optical Microsystems, Vol. 4, Issue 1, 019801 (March 2024). https://doi.org/10.1117/1.JOM.4.1.019801
Abstract

Erratum corrects errors in Table 2.
© 2024 Society of Photo-Optical Instrumentation Engineers (SPIE)
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David Coenen, Minkyu Kim, Herman Oprins, Yoojin Ban, Dimitrios Velenis, Joris Van Campenhout, and Ingrid De Wolf "Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic–electronic transceivers (Erratum)," Journal of Optical Microsystems 4(1), 019801 (18 March 2024). https://doi.org/10.1117/1.JOM.4.1.019801
Published: 18 March 2024
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KEYWORDS
3D modeling
Silicon
Silicon photonics
Thermal modeling
Transceivers
Modulators
Engineering
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