Open Access
1 July 2013 Field curvature correction in multichannel miniature imaging systems suited for wafer-level production
Author Affiliations +
Abstract
Using multiple optical channels increases the number of design possibilities for the objectives of mobile imaging devices. For easy wafer-level fabrication, we start from a single optical element—a monocentric plano-convex lens. The quality of the areal image is used to select the size of the field of each channel. Each channel optics is axially positioned to reduce the effect of the image field curvature. The resulting device has a small number of channels and it images a full field of view of ±40 deg with an f -number of 3. Details of the optical design, of the fabrication process, and of the device performance are reported.
CC BY: © The Authors. Published by SPIE under a Creative Commons Attribution 4.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.
Eric Logean, Toralf Scharf, Nicolas Bongard, Hans Peter Herzig, and Markus Rossi "Field curvature correction in multichannel miniature imaging systems suited for wafer-level production," Optical Engineering 52(7), 075101 (1 July 2013). https://doi.org/10.1117/1.OE.52.7.075101
Published: 1 July 2013
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication and 1 patent.
Advertisement
Advertisement
KEYWORDS
Monochromatic aberrations

Objectives

Image sensors

Image quality

Modulation transfer functions

Semiconducting wafers

Sensors

RELATED CONTENT

A multi-aperture imager for a wearable camera
Proceedings of SPIE (December 17 2014)
Design of camera lens based on curved full frame sensor
Proceedings of SPIE (January 23 2023)
Imaging lens design using image quality metric
Proceedings of SPIE (February 18 2004)
Wafer-level optics enables low cost camera phones
Proceedings of SPIE (February 09 2009)

Back to Top