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10 April 2024 Progress in resolving mask making challenges to enable HVM curvilinear patterning
Arvind Sundaramurthy
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Proceedings Volume PC12956, Novel Patterning Technologies 2024; PC1295608 (2024) https://doi.org/10.1117/12.3014935
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States
Abstract
The use of Inverse Lithography (ILT) in semiconductor manufacturing has been driving the need for curvilinear (CL) mask shapes. Complex CL mask shapes lead to an explosion in the vertex density (vertices/um^2) and file size at the mask shop vs. Manhattan corrections. This talk will review mask SEM CD and AIMS measurements from EUV and DUV masks made with end-to-end CL corrections (OPC, MPC and other mask CD corrections) at Intel mask operations (IMO). A path for significant file size reduction with the new MULTIGON record extension to the P39 OASIS file format will be reviewed. MULTIGON insertion involves significant changes in the mask making ecosystem that includes electronic tool design (EDA) tools, MBM writers and inspection tools. The talk will review the status of MULTIGON readiness and insertion at Intel.
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© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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Arvind Sundaramurthy "Progress in resolving mask making challenges to enable HVM curvilinear patterning", Proc. SPIE PC12956, Novel Patterning Technologies 2024, PC1295608 (10 April 2024); https://doi.org/10.1117/12.3014935
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KEYWORDS
Mask making
High volume manufacturing
Optical lithography
Electronic design automation
Extreme ultraviolet
Inspection
Lithography
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