Paper
19 September 2018 Performance validation of Mapper FLX-1200
Jonathan Pradelles, Yoann Blancquaert, Stefan Landis, Laurent Pain, Guido Rademaker, Isabelle Servin, Guido de Boer, Pieter Brandt, Michel Dansberg, Remco Jager, Jerry Peijster, Erwin Slot, Stijn Steenbrink, Marco Wieland
Author Affiliations +
Proceedings Volume 10775, 34th European Mask and Lithography Conference; 1077507 (2018) https://doi.org/10.1117/12.2324054
Event: 34th European Mask and Lithography Conference, 2018, Grenoble, France
Abstract
Operating maskless, massively parallel electron beam direct write (MEBDW) is an attractive alternative to optical lithography in micro and nano device manufacturing. Mapper Lithography develops MEBDW tools able to pattern wafers, for application nodes down to 28nm, with a throughput around one wafer per hour. A prototype tool from this series, named FLX-1200, is installed in the CEA-Leti clean room. This paper reviews the current performances of this prototype and the methodology used to measure them. On standardized exposure, consisting of 100 fields of 5×5mm2 exposed, in less than one hour, on 300mm silicon wafers, we obtained CD uniformity below 10nm (3σ) and LWR of 4.5nm for 60nm half pitch dense lines. We also demonstrate capability of 15nm and 25nm (3σ) for stitching and overlay errors respectively.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jonathan Pradelles, Yoann Blancquaert, Stefan Landis, Laurent Pain, Guido Rademaker, Isabelle Servin, Guido de Boer, Pieter Brandt, Michel Dansberg, Remco Jager, Jerry Peijster, Erwin Slot, Stijn Steenbrink, and Marco Wieland "Performance validation of Mapper FLX-1200", Proc. SPIE 10775, 34th European Mask and Lithography Conference, 1077507 (19 September 2018); https://doi.org/10.1117/12.2324054
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KEYWORDS
Semiconducting wafers

Overlay metrology

Prototyping

Optical scanning

Scanning electron microscopy

Line width roughness

Lithography

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