Paper
8 December 2022 High speed thin film thickness mapping by using dynamic spectroscopic imaging ellipsometry
Daesuk Kim, Vamara Dembele, Sukhyun Choi, Gukhyeon Hwang, Saeid Kheiryzadehkhanghah, Inho Choi, Junbo Shim
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Abstract
We describe a dynamic spectroscopic imaging ellipsometer employing a monolithic polarizing interferometer. It measures a spatio-spectral ellipsometric phase data Δ(λ,x) dynamically with a measurement speed of around 30Hz which enables us to measure a highly precise spectroscopic ellipsometric mapping data Δ(λ,x,y) for 10mm x 10mm area in a few tens of seconds with a high spatial resolution of tens of microns. The proposed system can provide ultrafast spectroscopic ellipsometric inspection capability for various semiconductor manufacturing applications.
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Daesuk Kim, Vamara Dembele, Sukhyun Choi, Gukhyeon Hwang, Saeid Kheiryzadehkhanghah, Inho Choi, and Junbo Shim "High speed thin film thickness mapping by using dynamic spectroscopic imaging ellipsometry", Proc. SPIE 12480, Optical Technology and Measurement for Industrial Applications Conference 2022, 124800O (8 December 2022); https://doi.org/10.1117/12.2660191
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KEYWORDS
Spectroscopy

Thin films

Imaging spectroscopy

Ellipsometry

Imaging systems

Silicon

Spatial resolution

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