Advanced high-voltage e-beam system combined with an enhanced D2DB for on-device overlay measurement

Seulki Kang; Kotaro Maruyama; Yuichiro Yamazaki; Matteo Beggiato; Anabela Veloso; Gian Lorusso

doi:10.1117/12.2661180

27 April 2023 Advanced high-voltage e-beam system combined with an enhanced D2DB for on-device overlay measurement

Seulki Kang, Kotaro Maruyama, Yuichiro Yamazaki, Matteo Beggiato, Anabela Veloso, Gian Lorusso

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124961W (2023) https://doi.org/10.1117/12.2661180
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

High voltage scanning electron microscopy (HV-SEM) has recently been adopted as an on-device overlay metrology tool. However, the chip-manufacturing industry requests more advanced tools capable of low-distortion imaging and versatile measurement functionality for multi-layer processing. We developed a high voltage e-beam inspection (HV-EBI) tool for on-device overlay metrology that fills the abovementioned requirement. The HV-EBI tool has the capability of variable acceleration voltage in the range of 30kV to 50kV and wide field of view (FOV) imaging up to a maximum of 50μm with extremely low first-order distortion in the level of <0.01% and 0.1mrad and uniform in-plane beam perpendicularity. In this paper, we demonstrate the performance of on-device overlay measurement by using the proposed HV-EBI tool combined with enhanced die-to-database (D2DB) algorithm and image processor.

Citation Download Citation

Seulki Kang, Kotaro Maruyama, Yuichiro Yamazaki, Matteo Beggiato, Anabela Veloso, and Gian Lorusso "Advanced high-voltage e-beam system combined with an enhanced D2DB for on-device overlay measurement", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124961W (27 April 2023); https://doi.org/10.1117/12.2661180

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