Track integrated backside cleaning solution: impact of backside contamination on printing distortions

Andreia Santos; Wesley Zanders; Elke Caron; Masahiko Harumoto; Jelle Vandereyken; Jan Hermans; Vincent Truffert; Sandip Halder; Ronald Otten; Leon van Dijk; Richard van Haren

doi:10.1117/12.2658418

29 May 2023 Track integrated backside cleaning solution: impact of backside contamination on printing distortions

Andreia Santos, Wesley Zanders, Elke Caron, Masahiko Harumoto, Jelle Vandereyken, Jan Hermans, Vincent Truffert, Sandip Halder, Ronald Otten, Leon van Dijk, Richard van Haren

Author Affiliations +

Proceedings Volume 12498, Advances in Patterning Materials and Processes XL; 1249809 (2023) https://doi.org/10.1117/12.2658418
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

Control of wafer backside defectivity is a challenge during the chip manufacturing process and has been extensively investigated throughout the past decade, especially on immersion lithography systems. As technology nodes continue to scale down and we approach the high NA EUV lithography era, backside contamination is becoming a critical problem. High NA EUV exposure systems have a smaller depth of focus compared to low NA EUV systems. The presence of backside wafer defects can easily lead to focus loss or on-product overlay errors leading to pattern failures. To anticipate the upcoming challenges, SCREEN has developed a sophisticated track-integrated backside cleaning (BSC) module on the DT-3000 system. This enables an advanced post-coating BSC solution directly before exposure. Together ASML, imec and SCREEN, investigated the potential of this unique BSC process to extend the lithographic performance of EUV material stacks, by correlating backside contamination with frontside patterning performance and the minimization of scanner focus spots. With this approach, we try to identify and characterize potential backside defect killers that could cause not only yield loss, but also physical deterioration of the scanner wafer table (WT) and its lifetime.

Conference Presentation

Citation Download Citation

Andreia Santos, Wesley Zanders, Elke Caron, Masahiko Harumoto, Jelle Vandereyken, Jan Hermans, Vincent Truffert, Sandip Halder, Ronald Otten, Leon van Dijk, and Richard van Haren "Track integrated backside cleaning solution: impact of backside contamination on printing distortions", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 1249809 (29 May 2023); https://doi.org/10.1117/12.2658418

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