Development of wafer edge protection layer for advanced patterning process

Takanori Kudo; JoonYeon Cho; Aritaka Hishida; Salem Mullen; Elizabeth Wolfer; Orest Polishchuk; Charito Antonio; Zhong Li

doi:10.1117/12.3010497

9 April 2024 Development of wafer edge protection layer for advanced patterning process

Takanori Kudo, JoonYeon Cho, Aritaka Hishida, Salem Mullen, Elizabeth Wolfer, Orest Polishchuk, Charito Antonio, Zhong Li

Author Affiliations +

Proceedings Volume 12957, Advances in Patterning Materials and Processes XLI; 129570Y (2024) https://doi.org/10.1117/12.3010497
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

Spin-on Metal Oxide Resist (MOR), Underlayer for EUV lithography and Spin-on Metal Hard Masks (MHM) are being studied for next generation semiconductor processes. Despite the immense potential of these new materials, the industry has paid enormous attention to avoid due to the general concern about trace metal impurities. Purposely introducing these metal-containing materials will inevitably raise alert, especially for track processes involving spin-coat layers that are currently handling primarily high purity organic materials. To address this new application challenge, or more specifically to protect the wafer edges from metal contamination during track processes, the authors have developed wafer Edge Protection Layer (EPL) material. EPL allows the wafer edge protection when the metal-containing coating is applied and the clean stripping with a proprietary solvent, EBR ACE to yield bevel and backside metal-free wafers that could be further processed as usual. This paper provides the key technical details of EPL material, process, and performance, with the aim to offer the industry a practical solution for safely introducing metal-containing spin-coat layers.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Takanori Kudo, JoonYeon Cho, Aritaka Hishida, Salem Mullen, Elizabeth Wolfer, Orest Polishchuk, Charito Antonio, and Zhong Li "Development of wafer edge protection layer for advanced patterning process", Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 129570Y (9 April 2024); https://doi.org/10.1117/12.3010497

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available