Automated vision system for inspection of wedge bonds

Koduri K. Sreenivasan; Mandayam D. Srinath; Alireza R. Khotanzad

doi:10.1117/12.130306

1 August 1992 Automated vision system for inspection of wedge bonds

Koduri K. Sreenivasan, Mandayam D. Srinath, Alireza R. Khotanzad

Proceedings Volume 1661, Machine Vision Applications in Character Recognition and Industrial Inspection; (1992) https://doi.org/10.1117/12.130306
Event: SPIE/IS&T 1992 Symposium on Electronic Imaging: Science and Technology, 1992, San Jose, CA, United States

Abstract

One of the problems in increasing reliability in the manufacture of integrated circuit devices is inspection of the bonds connecting the bond pads to the lead fingers to the device. The continuing increase in packing density of VLSI circuits requires that the inspection process be completely automated. Here we present a method for visual inspection of bonds which is intended to automatically extract parameters of significance in determining their quality froni two-dimensional images taken from the top of the IC wafer.

Citation Download Citation

Koduri K. Sreenivasan, Mandayam D. Srinath, and Alireza R. Khotanzad "Automated vision system for inspection of wedge bonds", Proc. SPIE 1661, Machine Vision Applications in Character Recognition and Industrial Inspection, (1 August 1992); https://doi.org/10.1117/12.130306

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